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which enhances material removal
Designed for metallographic and materials sample preparation
Recommended Micron Size: 3 - 0
Applications: Microelectronics
Designed specifically for applications demanding high levels of material removal on tough materials
EpoFlo Low-Viscosity Epoxy Resin 32oz Colloidal Silica which enhances material removalEpoFlo is a low viscosity epoxy system for casting metallographic samples. This two part epoxy produces relatively hard mounts and a low shrinkage rate. Resin Only (requires EpoFlo Hardener) *Mix with EpoFlo Hardener at 2 parts resin: 0. 9 part hardener Cure time: 8 hours at room temperature Cured Hardness: Shore D 76 Viscosity cps: 300 when mixed 32oz (946ml) Item No: EFH 2032
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